Quick Answer
The answer is the bonding kernel module. This is correct because the Linux bonding driver, loaded via `modprobe bonding` or compiled directly into the kernel, allows multiple network interfaces like eth0 and eth1 to be aggregated into a single logical bond interface, increasing throughput or providing redundancy as defined by IEEE 802.3ad and other bonding modes. On the LPIC-1 exam, this question tests your understanding of kernel module management and network interface aggregation—a common scenario where administrators confuse the module name with terms like "team" or "aggregate." A frequent trap is assuming the module is named after a specific mode (e.g., "802.3ad"), but the kernel always uses the generic name "bonding." For a quick memory tip, think: "Bonding binds interfaces together—the module name is simply bonding."
This LPIC-1 practice question tests your understanding of system architecture. Read the scenario carefully and evaluate each option against the stated constraints before committing to an answer. After answering, compare your reasoning against the explanation and wrong-answer breakdown below. Once you have made your selection, read the full explanation to reinforce the concept and understand why each distractor is designed to mislead on exam day.
A Linux system has two network interfaces: eth0 and eth1. The administrator wants to bond them for increased throughput. Which kernel module is required for bonding?
aggregation
Why wrong: Aggregation is a general concept, not a module name.
bonding
The bonding kernel module provides network interface bonding.
team
Why wrong: The team module is for teaming, a different technology.
bond
Why wrong: The module is named bonding, not bond.
Answer choices
Answer the question above first, then reveal the full breakdown to understand why each option is right or wrong.
Correct answer & explanation
bonding
The bonding driver in Linux allows multiple network interfaces to be aggregated into a single logical interface for increased throughput or redundancy. The correct kernel module is named 'bonding' (loaded via modprobe bonding or compiled into the kernel), which implements the IEEE 802.3ad Link Aggregation standard and other bonding modes. Option B is correct because 'bonding' is the exact module name used in the Linux kernel.
Key principle: Answer the scenario, not the keyword: identify the specific constraint before choosing the most familiar-sounding option.
Answer analysis
For each option: why learners choose it and why it is or isn't the right answer here.
aggregation
Why it's wrong here
Aggregation is a general concept, not a module name.
bonding
Why this is correct
The bonding kernel module provides network interface bonding.
Related concept
Read the scenario before looking for a memorised answer.
team
Why it's wrong here
The team module is for teaming, a different technology.
bond
Why it's wrong here
The module is named bonding, not bond.
Common exam traps
The trap here is that candidates confuse the interface name (bond0) with the kernel module name (bonding), or think 'team' is a synonym for bonding, when in fact they are separate technologies with different kernel modules.
Detailed technical explanation
The bonding module supports multiple modes, including balance-rr (round-robin), active-backup, and 802.3ad (LACP). When loaded, it creates virtual bond interfaces (e.g., bond0) that enslave physical interfaces; configuration is typically done via /etc/network/interfaces or netplan, and the module parameters (e.g., mode, miimon) are set in /etc/modprobe.d/. A real-world scenario: in a data center, bonding with LACP mode and miimon=100 ensures link failure detection within 100 ms, critical for high-availability storage traffic.
Key takeaway
Answer the scenario, not the keyword: identify the specific constraint before choosing the most familiar-sounding option.
Real-world example
A practitioner preparing for the LPIC-1 exam encounters this exact type of scenario on the job. The correct answer here is not the most general option — it is the best answer for the specific constraint described. Answer the scenario, not the keyword: identify the specific constraint before choosing the most familiar-sounding option. Real exam questions reward reading the full scenario before eliminating options, because the constraint defines which answer fits.
What to study next
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FAQ
System Architecture — This question tests System Architecture — Read the scenario before looking for a memorised answer..
The correct answer is: bonding — The bonding driver in Linux allows multiple network interfaces to be aggregated into a single logical interface for increased throughput or redundancy. The correct kernel module is named 'bonding' (loaded via modprobe bonding or compiled into the kernel), which implements the IEEE 802.3ad Link Aggregation standard and other bonding modes. Option B is correct because 'bonding' is the exact module name used in the Linux kernel.
Identify which exam domain this question belongs to, review the core concept, then practise similar questions from the same domain.
Read the scenario before looking for a memorised answer.
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Last reviewed: Jun 11, 2026
This LPIC-1 practice question is part of Courseiva's free LPI certification practice question bank. Courseiva provides original exam-style practice questions with explanations, topic-based practice, mock exams, readiness tracking, and study analytics to help learners prepare for the LPIC-1 exam.
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