LPIC-1 System Architecture Practice Question
A Linux system has two network interfaces: eth0 and eth1. The administrator wants to bond them for increased throughput. Which kernel module is required for bonding?
⚠ Common exam trap
Many candidates confuse the interface name (bond0) with the kernel module name (bonding), or think 'team' is a synonym for bonding, when in fact they are separate technologies with different kernel modules.
Answer choices
Why each option matters
Answer the question above first, then reveal the full breakdown to understand why each option is right or wrong.
Correct answer & explanation
✓
bonding
The bonding driver in Linux allows multiple network interfaces to be aggregated into a single logical interface for increased throughput or redundancy. The correct kernel module is named 'bonding' (loaded via modprobe bonding or compiled into the kernel), which implements the IEEE 802.3ad Link Aggregation standard and other bonding modes. Option B is correct because 'bonding' is the exact module name used in the Linux kernel.
Answer analysis
Option-by-option breakdown
For each option: why learners choose it and why it is or isn't the right answer here.
- ✗
aggregation
Why it's wrong here
No kernel module named aggregation exists; the bonding driver is what creates the bond0 master and enslaves eth0 and eth1. The term is tempting because link aggregation is the generic description of the technique, but the loadable module the kernel actually provides is named bond.
- ✓
bonding
Why this is correct
The bonding kernel module provides the driver that aggregates eth0 and eth1 into a single logical interface, enabling the throughput increase the administrator wants. Loading it is the prerequisite before any bond configuration can be applied.
- ✗
team
Why it's wrong here
The team module is a separate NIC-teaming implementation, not the bonding driver, so loading it provides no bond0 interface. It is tempting because teamd also aggregates links, and it would be correct where you deliberately choose teamd's userspace daemon model over the kernel bonding driver.
- ✗
bond
Why it's wrong here
bond is the correct bonding module, so this option does not fail the scenario; it is the answer. It is tempting only in the sense that it is the genuine kernel module name, and it would be the right choice precisely here, where two interfaces must be bonded for throughput.
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Written by Johnson Ajibi, MSc IT Security
Senior Network & Security Engineer · founder of Courseiva
This LPIC-1 practice question is part of Courseiva's free LPI certification practice question bank. Courseiva provides original exam-style practice questions with explanations, topic-based practice, mock exams, readiness tracking, and study analytics to help learners prepare for the LPIC-1 exam.