LPIC-1 System Architecture Practice Question
A Linux system has two network interfaces: eth0 and eth1. The administrator wants to bond them for increased throughput. Which kernel module is required for bonding?
⚠ Common exam trap
Many candidates confuse the interface name (bond0) with the kernel module name (bonding), or think 'team' is a synonym for bonding, when in fact they are separate technologies with different kernel modules.
Answer choices
Why each option matters
Answer the question above first, then reveal the full breakdown to understand why each option is right or wrong.
Correct answer & explanation
✓
bonding
The bonding driver in Linux allows multiple network interfaces to be aggregated into a single logical interface for increased throughput or redundancy. The correct kernel module is named 'bonding' (loaded via modprobe bonding or compiled into the kernel), which implements the IEEE 802.3ad Link Aggregation standard and other bonding modes. Option B is correct because 'bonding' is the exact module name used in the Linux kernel.
Answer analysis
Option-by-option breakdown
For each option: why learners choose it and why it is or isn't the right answer here.
- ✗
aggregation
Why it's wrong here
Aggregation is a general concept, not a module name.
- ✓
bonding
Why this is correct
The bonding kernel module provides network interface bonding.
- ✗
team
Why it's wrong here
The team module is for teaming, a different technology.
- ✗
bond
Why it's wrong here
The module is named bonding, not bond.
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Written by Johnson Ajibi, MSc IT Security
Senior Network & Security Engineer · founder of Courseiva
This LPIC-1 practice question is part of Courseiva's free LPI certification practice question bank. Courseiva provides original exam-style practice questions with explanations, topic-based practice, mock exams, readiness tracking, and study analytics to help learners prepare for the LPIC-1 exam.