220-1201 Practice Question: A technician is deploying a 3D printer that uses…

Answer analysis

Option-by-option breakdown

For each option: why learners choose it and why it is or isn't the right answer here.

• ✗

  Increase the nozzle temperature by 10°C

  Why it's wrong here

  Increasing the nozzle temperature by 10°C is unlikely to resolve poor first layer adhesion and could introduce new problems. While a slightly higher temperature might improve filament flow, it does not address the critical mechanical issue of incorrect nozzle-to-bed distance. Excessive heat can lead to filament oozing, 'elephant's foot' on the first layer, or increased warping due to greater thermal expansion, all of which can further compromise adhesion rather than improve it.

• ✗

  Apply a layer of glue stick to the build plate

  Why it's wrong here

  Applying a layer of glue stick to the build plate is a supplementary measure that enhances surface adhesion but does not correct fundamental mechanical issues. Adhesives are most effective when the filament is properly squished onto the build surface, maximizing contact area. If the bed leveling or Z-offset is incorrect, causing the nozzle to be too far from the plate, the filament will not make sufficient contact for the adhesive to form a strong bond, rendering it largely ineffective.

• ✓

  Adjust the bed leveling or Z-offset to ensure proper first layer height

  Why this is correct

  Adjusting the bed leveling or Z-offset to ensure proper first layer height is the most critical step for resolving poor adhesion. Correct bed leveling ensures the build plate is uniformly equidistant from the nozzle across its entire surface, while the Z-offset fine-tunes the nozzle's starting height. Achieving the ideal first layer height, where the filament is slightly compressed onto the bed, maximizes the contact area and promotes strong mechanical bonding, which is essential for preventing prints from detaching.

• ✗

  Reduce the print speed

  Why it's wrong here

  Reducing the print speed can sometimes marginally improve first layer adhesion by allowing more time for the molten filament to bond with the build plate. However, this is a compensatory adjustment and does not address the root cause of poor adhesion, which is typically an incorrect nozzle-to-bed distance. If the nozzle is too high, the filament will be laid down without adequate compression, regardless of how slowly it is extruded, resulting in weak adhesion that will likely fail.

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